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The 1769-CLL3 is a left-to-left bus expansion cable used in Compact I/O automation systems. It is designed to electrically connect two I/O banks within a Compact I/O chassis, enabling system expansion and distributed module grouping.
This component does not process signals or perform control logic. Its role is purely physical and electrical interconnection, ensuring reliable backplane communication between separated module groups.
It is commonly used when a Compact I/O system requires segmentation into multiple power zones or when system layout flexibility is needed.
Brand: Industrial automation control platform (Compact I/O ecosystem)
Series: 1769 Compact I/O Series
Product Family: Bus Expansion Accessories
Module Type: Left-to-Left Communication Bus Expansion Cable
The 1769-CLL3 provides electrical continuity between Compact I/O module banks.
Core functions include:
A maximum of two bus expansion cables can be used in a single system, enabling up to three separate I/O banks.
| Parameter | Value |
|---|---|
| Function Type | Backplane bus expansion connection |
| Signal Type | Parallel backplane communication |
| Compatibility | Compact I/O 1769 architecture |
| Max System Expansion | Up to 3 I/O banks |
| Cable Limit per System | Max 2 expansion cables |
| Electrical Isolation | System-level isolation support |
| Parameter | Value |
|---|---|
| Cable Length | 1.0 m (3.28 ft) |
| Physical Dimensions (installed) | Approx. 160 mm × 50 mm × 255 mm (system dependent) |
| Weight | 0.10 kg – 0.33 kg |
| Connector Type | Left-to-left backplane connectors |
| Installation Method | Plug-in chassis connection |
| Housing | Industrial-grade insulated cable assembly |
| Parameter | Value |
|---|---|
| Operating Temperature | 0°C to 60°C |
| Storage Temperature | -40°C to 85°C |
| Humidity | 5% – 95% non-condensing |
| Vibration Resistance | Industrial panel rated |
| Shock Resistance | IEC industrial standard compliance |
Allows Compact I/O systems to be divided into multiple independent banks, improving layout flexibility.
Enables system scaling without redesigning the entire backplane structure.
Each I/O bank can be powered separately, improving electrical stability and fault isolation.
Maintains stable and synchronized communication between distributed module groups.
Helps overcome physical space limitations in control panels by separating I/O clusters.
The 1769-CLL3 is commonly used in:
It is especially useful where a single I/O chassis must be divided into electrically isolated groups.
| Model | Type | Key Parameters | Application |
|---|---|---|---|
| 1769-CRR3 | Right-to-Right Bus Cable | 1 m expansion cable, backplane link | I/O bank expansion |
| 1769-CRL3 | Right-to-Left Bus Cable | 1 m expansion connection | Mixed bank linking |
| 1769-L36ERM | PLC Controller | High-speed processor, EtherNet/IP | Advanced control systems |
| 1769-AENTR | Ethernet Adapter Module | Dual-port EtherNet/IP communication | Distributed I/O networking |
| 1769-IF8 | Analog Input Module | 8-channel signal acquisition | Process monitoring |
| Model | Type | Key Parameters | Application |
|---|---|---|---|
| 1769-L33ER | PLC Controller | Integrated EtherNet/IP CPU | Machine automation |
| 1769-SDN | DeviceNet Scanner Module | Master fieldbus communication | Legacy network integration |
| 1769-ADN | DeviceNet Adapter | Remote I/O adapter module | Distributed systems |
| 1769-ASCII | Serial Communication Module | Dual-port ASCII interface | Barcode/printer systems |
| 1769-PA4 | Power Supply Module | AC input system power supply | Rack power distribution |
The 1769-CLL3 is a structural communication accessory within Compact I/O systems, enabling physical and electrical expansion of I/O banks. It does not perform logic or signal processing but plays a key role in system architecture flexibility.
Its main value lies in system segmentation, scalable layout design, and reliable backplane communication between multiple I/O groups.
It is an essential component for large or modular automation systems requiring distributed architecture within a single control platform.